JPH0530363Y2 - - Google Patents

Info

Publication number
JPH0530363Y2
JPH0530363Y2 JP1989124531U JP12453189U JPH0530363Y2 JP H0530363 Y2 JPH0530363 Y2 JP H0530363Y2 JP 1989124531 U JP1989124531 U JP 1989124531U JP 12453189 U JP12453189 U JP 12453189U JP H0530363 Y2 JPH0530363 Y2 JP H0530363Y2
Authority
JP
Japan
Prior art keywords
frame
semiconductor chips
upper lid
resin layer
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989124531U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0363946U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989124531U priority Critical patent/JPH0530363Y2/ja
Publication of JPH0363946U publication Critical patent/JPH0363946U/ja
Application granted granted Critical
Publication of JPH0530363Y2 publication Critical patent/JPH0530363Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1989124531U 1989-10-26 1989-10-26 Expired - Lifetime JPH0530363Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989124531U JPH0530363Y2 (en]) 1989-10-26 1989-10-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989124531U JPH0530363Y2 (en]) 1989-10-26 1989-10-26

Publications (2)

Publication Number Publication Date
JPH0363946U JPH0363946U (en]) 1991-06-21
JPH0530363Y2 true JPH0530363Y2 (en]) 1993-08-03

Family

ID=31672442

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989124531U Expired - Lifetime JPH0530363Y2 (en]) 1989-10-26 1989-10-26

Country Status (1)

Country Link
JP (1) JPH0530363Y2 (en])

Also Published As

Publication number Publication date
JPH0363946U (en]) 1991-06-21

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